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Our testing and inspection processes guarantee industry-leading reliability. Using in-circuit testing (ICT), functional validation and advanced diagnostics, our engineering team designs and fabricates custom test solutions to ensure flawless performance and compliance at every stage.
DFT evaluates and enhances a design’s testability coverage, ensuring that built-in diagnostics and validation checkpoints are in place for efficient and accurate testing.
Our debug and troubleshooting processes are powered by diagnostic tools such as TK1P, allowing for precise defect localisation.
Automated optical inspection instantly identifies placement errors and defects with precision and speed.
A3070 ICT combines fast, precise in-circuit testing, boundary scan capabilities and functional testing with programmable test points for efficient fault detection and validation.
Through DFT-driven design, we develop test systems that deliver maximum coverage and meet customer-defined specifications.
X-ray inspection assesses solder joint quality in key interconnect areas, including barrel fill verification for through-hole components and void or misalignment detection in BGA solder joints.
Supporting onboard and offline programming for a wide range of devices, enabling firmware loading at various stages of the manufacturing process.
Our MES-driven system manages MAC address allocation with strict process controls, preventing duplication or omissions and ensuring full traceability across the production cycle.