Building the Foundation for a Smarter World
Our Capabilities
Delivering Excellence in Semiconductor Solutions
We combine global expertise, cutting-edge innovation, and a customer-first approach to deliver solutions that set new standards in semiconductor manufacturing.
Customised Manufacturing Solutions
Tailored manufacturing solutions designed to meet the specific requirements of semiconductor modules.
Positioned for Semiconductor Supply Chain Access
Strategic presence in Asia and North America enables global support for equipment manufacturers.
Semiconductor Tools Manufacturing Excellence
Cleanroom manufacturing of lithography tools with stringent process controls to ensure reliability and precision.
Intellectual Property Management
IP protection ensured through ISO 27001 certification, secure infrastructure, and strong governance protocols.
Our Proven Solutions
Innovating Semiconductor Manufacturing Through Global Collaboration
In partnership with our global network, we provide vertically integrated manufacturing solutions for the semiconductor industry. From high-precision machining and cable assemblies to cleanroom systems, we meet the demands of capital equipment manufacturing. Strategically located near semiconductor ecosystems and continuously expanding our capabilities, we enable our customers to accelerate innovation and gain a competitive advantage.
Lithography Machines
We manufacture, repair and upgrade lithography tools to ensure optimal performance, reliability and an extended lifecycle.
Metal Solutions for Lithography Tools
Precision-machined components and fabricated metal parts engineered for lithography tools—ensuring structural integrity and high-performance integration.
Bundled Cable Harness Solutions
Bundled cable assemblies engineered for signal integrity, durability, and efficient integration in lithography tools—tested in cleanroom environments for reliability.
Clean Room Assemblies
Precision assembly in ISO Class 7 & 8 cleanrooms for lithography tools—incorporating leakage control and alignment processes to achieve stringent mechanical tolerances and accuracy.
Case Study: 3D Printer Precision Box Build with Embedded Electronics
Case Study: 3D Printer Precision Box Build with Embedded Electronics
A customer needed to commercialise a complex 3D printing system while running NPI in parallel across multiple design teams. With no internal manufacturing capability, the entire build had to be executed externally under strict budget and timeline constraints.
FVG deployed subject matter experts in metals, electronics, wiring, and system integration directly at the client’s R&D hub to support problem solving and process scale-up. By leveraging Malaysia’s robust manufacturing ecosystem, FVG established a flexible build platform that supported both design evolution and commercialisation.
Manufacturing Process:
System Integration: Full mechanical assembly with embedded electronics, wiring, and metal structures.
Collaboration: On-site engineering support to align R&D and production scale-up.
Box Build Solution: A complete end-to-end build platform capable of evolving alongside product design requirements.
Outcome:
FVG delivered the full NPI build in just 4 weeks by combining DVT and PVT cycles, supported by a cross-functional team of specialists. The project achieved cost targets of US$100K per unit, well below the industry benchmark of US$200K–800K. Just as important, the production framework was designed with foresight, so the path from prototype to higher volumes was already in place.
Insights
Gain Access Into Our Team’s Perspectives and Insights on the Topic