Powering the Future of Connectivity with Scalable, High-Performance Solutions
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Our Capabilities
Need a Manufacturing Partner to Scale with Your Network Demands?
We build smart, compact systems for conferencing system and connected control applications. With RF optimisation, high-density PCBAs, and test-driven validation, our solutions are engineered for consistent field performance and scalable production.
High-Density, Impedance-Controlled PCBA for Telecommunications Systems
Our advanced SMT capabilities support ultra-compact board designs with smallest component to fine pitch FPGA precision placement, automated inspection, X-ray and board level testing.
Design for testability (DFT) for complex telecommunications PCBA
Through Design for Testability (DFT), we develop smart test strategies that enhance coverage, validate performance, and ensure every unit meets the quality standards our customers expect.
Our Proven Solutions
Delivering performance, compliance, and scalability across complex electronics systems.
Office Conferencing Systems
Our manufacturing and test solutions for these products are structured to meet Microsoft Teams and Zoom certification standards, ensuring compliance across a range of conferencing products including speakers, cameras, and collaboration endpoints.
Asset Control & Landscape Monitoring Devices
Outdoor-ready devices with rugged enclosures and embedded RF systems—ideal for smart cities, infrastructure management, and remote asset tracking.
Data Centre Infrastructure
Control and power modules built to support scalable, high-density networking infrastructure in data centre environments ensuring stability.
Case Study: Developing an Ingress Enabled Wearable for IoT Application
Case Study: Developing an Ingress Enabled Wearable for IoT Application
To develop a lightweight, durable, and RF-optimised wearable module that meets IP68 standards and supports efficient manufacturing. The electronics needed to be compact and seamlessly embedded into a textile-based form factor.
Manufacturing Process:
Thermal & Structural Design: A removable elastomeric enclosure is added to support thermal conductivity and reduce weight, while maintaining structural integrity.
Potting & Encapsulation: Electronics are embedded using FVG’s two-part elastomeric potting material, offering high dielectric strength and IP68-compliant protection.
Final Integration: The module integrates RF components and lightweight batteries into a fabric vest, ensuring high signal performance and wearability.
Application & Outcome: The resulting wearable module is rugged, lightweight, and built for demanding environments. Seamlessly integrated into fabric vests, it ensures strong connectivity, water and dust resistance, and scalable manufacturability—without compromising comfort or mobility.