Powering the Future of Connectivity with Scalable, High-Performance Solutions
We build smart, compact systems for conferencing system and connected control applications. With RF optimisation, high-density PCBAs, and test-driven validation, our solutions are engineered for consistent field performance and scalable production.
Our advanced SMT capabilities support ultra-compact board designs with smallest component to fine pitch FPGA precision placement, automated inspection, X-ray and board level testing.
Through Design for Testability (DFT), we develop smart test strategies that enhance coverage, validate performance, and ensure every unit meets the quality standards our customers expect.
To develop a lightweight, durable, and RF-optimised wearable module that meets IP68 standards and supports efficient manufacturing. The electronics needed to be compact and seamlessly embedded into a textile-based form factor.
Manufacturing Process:
Thermal & Structural Design: A removable elastomeric enclosure is added to support thermal conductivity and reduce weight, while maintaining structural integrity.
Potting & Encapsulation: Electronics are embedded using FVG’s two-part elastomeric potting material, offering high dielectric strength and IP68-compliant protection.
Final Integration: The module integrates RF components and lightweight batteries into a fabric vest, ensuring high signal performance and wearability.
Application & Outcome: The resulting wearable module is rugged, lightweight, and built for demanding environments. Seamlessly integrated into fabric vests, it ensures strong connectivity, water and dust resistance, and scalable manufacturability—without compromising comfort or mobility.